Component Testing

BGA offers services to semiconductor manufacturers, Electronic Manufacturing Services (EMS) providers, Original Equipment Manufacturers (OEM's) and electronics distributors. Services offered include, BGA Solder Ball Attach, BGA Reball and Repair, Pb to PB free Conversion, Pb free to Pb Conversion, Lead Conditioning (Repair), ROHS XRF Analysis, Lead Tinning Service, Bake & Dry-Pack, I.C. Counterfeit Detection, PCB Device Reclaim and Device Attributes.